Robust snubberless soft-switching power converter using SiC power MOSFETs and bespoke thermal design

A number of harsh-environment high-reliability applications are undergoing substantial electrification. The converters operating in such systems need to be designed to meet both stringent performance and reliability requirements. Semiconductor devices are central elements of power converters and key enablers of performance and reliability. This paper focuses on a DC–DC converter for novel avionic applications and considers both new semiconductor technologies and the application of design techniques to ensure, at the same time, that robustness is maximized and stress levels minimized. In this respect close attention is paid to the thermal management and an approach for the heatsink design aided by finite element modelling is shown

Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability

An alternative integration scheme for a half-bridge switch using 70 μm thin Si IGBTs and diodes is presented. This flat switch, which is designed for high-frequency application with high power density, exhibits high strength, high toughness, low parasitic inductance and high thermal conductivity. Such a novel assembly approach is suitable to optimize performance, reliability and availability of the power system in which it is used. The paper focuses on the thermal performance of this assembly at normal and extreme operating conditions, studied by means of FEM thermo-fluidynamic simulations of the module integrated with connectors and liquid cooler, and thermal measurement performed on an early prototype. Improved solutions are also investigated by the FE model

Why compatibilist intuitions are not mistaken: a reply to Feltz and Millan

In the past decade, a number of empirical researchers have suggested that laypeople have compatibilist intuitions. In a recent paper, Feltz and Millan (2015) have challenged this conclusion by claiming that most laypeople are only compatibilists in appearance and are in fact willing to attribute free will to people no matter what. As evidence for this claim, they have shown that an important proportion of laypeople still attribute free will to agents in fatalistic universes. In this paper, we first argue that Feltz and Millan’s error-theory rests on a conceptual confusion: it is perfectly acceptable for a certain brand of compatibilist to judge free will and fatalism to be compatible, as long as fatalism does not prevent agents from being the source of their actions. We then present the results of two studies showing that laypeople’s intuitions are best understood as following a certain brand of source compatibilism rather than a “free-will-no-matter-what” strategy

a preliminary investigation of strength models for degenerate graphite clusters in grey cast iron

Abstract Defects morphology primarily affects the mechanical properties of grey cast iron. In large castings, porosity and clusters of degenerate graphite are heterogeneously dispersed into the ferrous matrix and serve as initiation sites for fatigue and fracture processes. Strength and toughness of nodular cast iron compare to many grades of steel but experiments show that nodular cast iron also exhibits some specific effects, different from those typical of steels and due to cast iron microstructural inhomogeneity. In the present communication, we report on a preliminary investigation aimed at correlating the effect of the graphite microstructure to the mechanical properties of the material via a simplified geometrical description of the defects

Modular assembly of a single phase inverter based on integrated functional block

This paper presents an original modular plug-in type assembly approach for a single phase-inverter. The main focus here is, indicatively, on the power range 1-20 kW, but the methodology can be transferred to higher power levels, too. At the core of the inverter lies a power-dense double-sided-cooled half-bridge power switch architecture with integrated cooler, which is interconnected to filter elements, gate-driver and control circuitry by means of compact flat connectors. The integration exercise targets, on the one hand, the optimization of the power switch performance and reliability, as well as the reduction of circuit parasitic elements; on the other, the production of a system compatible with maintenance and repairing, featuring minimized impact of single component failure on the system maintenance and repair cost and thus on its availability. Preliminary experimental tests demonstrate the nominal functionality of the inverter

Introduction (<Special Sessions>International Symposium in Shanghai : Multilateral Comparative Study of the Historical Archives : Historical Documents, and Family, Business and Society in East Asia)

This paper presents the work on an alternative integration scheme for a half-bridge switch using 70 μm thin Si IGBTs and diodes addressing higher strength, higher toughness and higher thermal conductivity. The switch is totally bond wireless, since bonded wires increase self-heating and introduce further thermomechanical degradation mechanisms. Moreover, this solution is equipped with double side liquid cooling, and plug-in edge connectors both on the driver and load sides, allowing high power density, good accessibility and modularity. Preliminary experimental results show good switching behavior

Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch

The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 V–35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters. An accurate electro-thermal fluid dynamic model is set up and validated by thermal characterization on a prototype; numerical models have been used to study the internal temperature distribution and to propose further optimization

CHARM facility remotely controlled platform at CERN: A new fault-tolerant redundant architecture

Many power electronics applications require high tolerance to faults such as short circuit or open circuit of the control signals. One such application is the CERN High energy AcceleRator Mixed-field (CHARM) facility, where maintenance may be precluded for long periods of time due to radiation and, therefore, high reliability is necessary. A redundant interconnection architecture for the control signals is proposed, where each signal is individually processed by different CPUs and transmitted through separate interconnection lines. During normal operation, the CPUs are synchronized and produce the same signals. The purpose of the proposed hardware and firmware strategy is to allow the actuator to continue operating even in case of fault; regardless of the fault type (open circuit, short circuit to ground or to positive supply), a fault on one of the parallel lines would not inhibit the correct operation of the remaining line. This solution can be used to control the movements of a target system using a remote joystick in a safe environment. The architecture features reliable transmission of PWM signals driving a half-bridge power converter. Moreover, it is possible to extend it to any type of converter such as three-phase bridges, three-level NPC, or buck-boost converters. Simulations and experimental results show a good agreement, proving the effectiveness of the proposed fault tolerant circuitry